CLP 7106 / CLI 4010

Flexible polyurethane system for potting and casting in electrical applications. A two component, low viscosity, low durometer, polyurethane potting compound. The cured material meets the requirements of UL94-V0. CLP 7106 / CLI 4010

CLR 1020 / CLH 6021

Semi-flexible epoxy adhesive and casting system. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1020 / CLH 6021

CLR 1026 / CLH 6021

Low viscosity, semi-flexible. An unfilled, semi-flexible two component epoxy system. Its low mixed viscosity makes it suitable for potting and encapsulating electronic components. CLR 1026 / CLH 6021

CLR 1066 / CLH 6330

Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6330

CLR 1066 / CLH 6520

Low Exotherm, Low shrinkage epoxy. A two component, long pot life casting system with low exotherm, low shrinkage and excellent thermal shock resistance. CLR 1066 / CLH 6520

CLR 1066 / CLH 6930

Large mass casting, 30-minute pot life. Masses larger than 6Lbs. A two component, filled, room temperature cure epoxy system.the product has a low exotherm and low shrinkage, making it suitable for castings larger than 3 kgs. CLR 1066 / CLH 6930

CLR 1190 / CLH 6025

General purpose variable substrate adhesive. A medium viscosity, unfilled casting system. It is suitable for large mass castings and exhibits good impact resistance. CLR 1190 / CLH 6025

CLR 1796 / CLH 6580

UL 94-V0 system for potting and casting small electronic parts that require thermal shock and thermal cycling performance. A two component, low viscosity, room temperature cure epoxy system. Material has yellow card UL94-V0 rating, and contains non abrasive fillers suitable for meter mix dispense. CLR 1796 / CLH 6580

XPD 1401 / CLI 4182

Density = 0.80. A low viscosity, low density, user-friendly, room temperature cure, MDI based polyurethane system. The product cures to a hardness of 60 shore A, and has a cured density of 0.80 gms/cm3. XPD 1401 / CLI 4182

XRD 1014 / XHD 1015

High temperature clear epoxy. An unfilled, heat resistant, clear laminating system. Products low viscosity gives the system excellent wet-out properties to fibreglass and other reinforcing fibres. The material exhibits high physical strengths and modulus with moderate post cure temperatures. XRD 1014 / XHD 1015

XRD 1018 / XHD 1019

1:1 Mix Ratio, 130°C Operating, General Purpose, Low cost. A two component, room temperature cure semi-flexible, flame retardant, epoxy system. The system was developed for potting/casting of electrical and electronic components. Its use of non-abrasive fillers and convenient 1 to 1 ratio by volume, make it ideal for use in machine dispensing equipment. This product meets UL94-V0 in house flammability testing. XRD 1018 / XHD 1019